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Friday, May 1, 2020 | History

2 edition of Mechanical properties of intermetallic compounds found in the catalog.

Mechanical properties of intermetallic compounds

J. H. Westbrook

Mechanical properties of intermetallic compounds

a symposium held during the 115th meeting of the Electrochemical Society at Philadelphia, Penn., May 3-7, 1959.

by J. H. Westbrook

  • 400 Want to read
  • 29 Currently reading

Published by Wiley in New York .
Written in English

    Subjects:
  • Alloys -- Congresses.,
  • Metallurgy -- Congresses.

  • Edition Notes

    Includes bibliographies.

    GenreCongresses.
    ContributionsElectrochemical Society.
    The Physical Object
    Pagination435 p.
    Number of Pages435
    ID Numbers
    Open LibraryOL17772296M

      Nanotechnology has paved the way for the research and development of new classes of materials and how we use them. With the desire to decrease the size of devices all while having advanced properties, research in this field and the development of small-scale experimental techniques has become significantly important. Materials can deform in Author: John Sypek. @article{osti_, title = {Exploring phase stability, electronic and mechanical properties of Ce–Pb intermetallic compounds using first-principles calculations}, author = {Tao, Xiaoma and Computational Alloy Design Group, IMDEA Materials Institute, Getafe, Madrid and Wang, Ziru and Lan, Chunxiang and Xu, Guanglong and Ouyang, Yifang and Du, Yong}, . Preparation. MgCu 2 can be prepared by hydrogenation of Mg 2 Cu or the reaction of magnesium hydride and metallic copper at elevated temperature and pressure. 2 Mg 2 Cu + 3 H 2 → 3 MgH 2 + MgCu 2 MgH 2 + 2 Cu → MgCu 2 + H 2. MgCu 2 can also be prepared by reacting of stoichiometric amounts of metals at about °C in the presence of excess copper.. Properties. MgCu CAS Number:   This research program has examined mechanical behavior and creep of titanium aluminide alloys, both based on Ti3Al and TiAl, with the goal being better understanding of relationships between microstructure and mechanical properties of these intermetallic compound-based alloys.


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Mechanical properties of intermetallic compounds by J. H. Westbrook Download PDF EPUB FB2

About the Author. Westbrook is the editor of Intermetallic Compounds, Volume 2, Basic Mechanical Properties and Lattice Defects of, published by Wiley. Fleischer is the editor of Intermetallic Compounds, Volume 2, Basic Mechanical Properties and Lattice Defects of, published by : Paperback.

- Basic Mechanical Properties and Lattice Defects of Intermetallic Compounds J. Westbrook, R. Fleischer This is one of four volumes, each of which consists of reprinted chapters from the two-volume set, published in Symposium on the Mechanical Properties of Intermetallic Compounds ( Philadelphia, Pa.).

Mechanical properties of intermetallic compounds. New York, Wiley [] (OCoLC) Material Type: Conference publication: Document Type: Book: All Authors / Contributors: J H Westbrook. Structure and Mechanical Properties of Transition Group Metals, Alloys, and Intermetallic Compounds.

Tomasz Czujko (Ed.) Pages: Published: July (This book is a printed edition of the Special Issue Structure and Mechanical Properties of Transition Group Metals, Alloys, and Intermetallic Compounds that was published in Materials.

elements also influences the mechanical properties of intermetallic compounds. The bonding energy between unlike atoms in intermetallic compounds is larger than the average of those between atoms of the same element.

This causes high elastic coefficients, typically higher than those for ordinary structural metals and alloys like steels, Ti alloys, and AlCited by:   With contributions from 72 authors from 14 different countries, this book introduces a broad range of new topics including: new intermetallic families, new means of assessment of bonding and stability, new properties and phenomena, new applications, new practical processes and new research techniques.

The attractive physical and mechanical properties of ordered intermetallic alloys have been recognized since early in this century. However, periodic attempts to develop intermetallics for structural applications were unsuc­ cessful, due in major part to the twin handicaps of inadequate low-temper­ ature ductility or toughness, together with poor elevated-temperature creep strength.

The mechanical properties of intermetallic compounds in the Au–Sn system were investigated by nanoindentation. Measurements of hardness and. Mechanical properties of intermetallic compounds in the Au–Sn system R.R. Chromik,a) D-N. Wang, A. Shugar, L. Limata, M.R. Notis, and R.P.

Vinci Department of. Three intermetallic compounds (Cu 6 Sn 5, Cu 3 Sn, and Ni 3 Sn 4) commonly found in solder joints have been prepared by gas atomization and then consolidated into bulk forms with microstructures similar to those observed in actual joints.

Physical and mechanical properties relevant to the performance of joints have been measured for these materials. The mechanical properties of intermetallic compounds in the Au–Sn system were investigated by nanoindentation.

Measurements of hardness and elastic modulus were obtained for all of the confirmed room-temperature intermetallics in this system as well as the β phase (8 at.% Sn) and AuSn 4.

Overall, it was found that the Au–Sn compounds have Cited by: J. Westbrook is the editor of Intermetallic Compounds, Volume 4, Magnetic, Electrical and Optical Properties and Applications of, published by Wiley.

Fleischer is the editor of Intermetallic Compounds, Volume 4, Magnetic, Electrical and Optical Properties and Applications of, published by : Paperback. Mechanical properties of Al-Si-X alloys are greatly affected by the structures of the intermetallic. Intermetallics compounds appear more in recycled Al-Si based alloys, however, cycling which is a secondary production process of Mechanical properties of intermetallic compounds book and its alloys is cheaper than primary production : Williams S.

Ebhota, Tien-Chien Jen. Ordered intermetallics constitute a unique class of metallic materials which may be developed as new-generation materials Mechanical properties of intermetallic compounds book structural use at high temperatures in hostile environments.

At present, there is a worldwide interest in intermetallics, and extensive efforts have been devoted to intermetallic research and development in the U.S. Abstract: Intermetallic compounds (IMCs) that grow on the interface between the solder alloy and its bonding pads play a crucial role in the reliability of solder joints.

It has been identified that the cracking around the IMC layer is the primary failure mode in lead-free solder joints. Therefore the mechanical behavior of the IMC has attracted great attentions.

The Role of Intermetallic Compounds in Controlling the Microstructural, Physical and Mechanical Properties of Cu-[Sn-Ag-Cu-Bi]-Cu Solder Joints Reza Sayyadi 1 Homam Naffakh-Moosavy 1Cited by: 1. High Temperature Deformation and Mechanical Properties.

New concepts of analyzing plastic deformation of TiAI and Ni3AI intermetallic compounds. Mechanical properties of boron–doped directionally–solidified Ni3AI containing carbon, magnesium, calcium and rare earth elements.

Creep and Superplasticity. Creep in titanium Edition: 1. In this chapter, results of our recent investigations on Al%Fe (at.%), Al%Fe and Al%Fe alloys close to Al3Fe, Al5Fe2 and Al2Fe intermetallic phases have been discussed. The effect of process parameters on structural aspects and mechanical behaviour of Al-Fe intermetallics has been studied.

The high melting intermetallics that are difficult to prepare by conventional Cited by: 1. 4 Aging of Interfacial Intermetallics. Intermetallic compounds form between pad metallization and the active components of the molten solder (typically tin).

For a copper metallization, the tin reacts to form Cu 3Sn and Cu 6Sn 5 intermetallics. For nickel, the tin reacts to form Ni 3Sn 4. The congruently melting, single phase, intermetallic compounds β-Ni3Ge and ε-Ni5Ge3 were produced by arc melt.

Each was subject to rapid solidification via drop-tube processing. Each compound remained fully single phase (either β-Ni3Ge or ε-Ni5Ge3) irrespective of the imposed cooling rate.

In the investigation of β-Ni3Ge compound, droplets spanning the size range Author: Nafisul Haque, Oluwatoyin E Jegede, Andrew M Mullis.

Xu researched the electronic structures, mechanical properties and thermodynamic properties of the Co-based Co 3 X (X = Ti, Ta, W, V and Al) intermetallic compounds by first-principle calculations, and found that obtained elastic parameters of Co 3 X compounds hold a linearly increasing trend as the melting point of the metallic element of X by: 4.

Mechanical properties of single-phase crystalline media: deformation in the presence of diffusion (A.S. Argon). Mechanical properties of solid solutions (P. Haasen†). Mechanical properties of intermetallic compounds (D.P.

Pope). Mechanical properties of multiphase alloys (J.-L. Strudel). Fracture (R.M. Thomson). Fatigue (C. Laird).Book Edition: 4. Improving the strength of a metal alloy is hard to do without sacrificing the ductility.

Yang et al. designed an iron-nickel-cobalt (Fe-Ni-Co) alloy laced with aluminum-titanium (Al-Ti) nanoparticles with both high strength and ductility. The key was getting the composition tuned correctly, because the Fe-Ni-Co matrix reacts with the Al-Ti nanoparticles.

This was vital for Cited by: Three chapters on new topics have been added, dealing with dry corrosion, oxidation and protection of metal surfaces; the dislocation theory of the mechanical behavior of intermetallic compounds; and (most novel) a chapter on polymer science for metallurgists, which analyses the conceptual mismatch between metallurgists' and polymer scientists 3/5(1).

Mechanical properties of Rh-based L12 intermetallic compounds Rh3Ti, Rh3Nb and Rh3Ta. This junior/senior textbook presents fundamental concepts of structure property relations and a description of how these concpets apply to every metallic element except iron. Part One of the book describes general concepts of crystal structure, microstructure and related factors on the mechanical, thermal, magnetic and electronic properties of nonferrous metals, intermetallic compounds.

Basic properties that are insensitive to processing history can be used to provide a preliminary ranking of single-phase substances. A compilation is presented of intermetallic compounds (or metal-metalloid compounds) that melt at T ⩾ ° by: Effect of Intermetallic Compounds on the Thermal and Mechanical Properties of Al–Cu Composite Materials Fabricated by Spark Plasma Sintering by Kyungju Kim 1,2, Dasom Kim 3,4, Kwangjae Park 3, Myunghoon Cho 2, Seungchan Cho 5 and Hansang Kwon 2,4,*Cited by: 5.

A suite of 36 alloys has been tested that is based on titanium-containing ordered intermetallic compounds. Microhardness and tendency toward formation of cracks are reported as a function of temperature; room-temperature Young’s moduli are summarized; and results of simple roomtemperature toughness tests are given.

Using toughness, low specific gravity, and Cited by: Abstract The present work provides a comprehensive compilation and discussion covering hardness, experimentally determined elastic properties, thermal expansion, and Debye and Einstein temperatures for intermetallic clathrates. Comparing hardness values and elastic properties a major influence of the framework atoms is observed.

Abstract: In high power automotive electronics copper wire bonding is regarded as most promising alternative for gold wire bonding in 1 st level interconnects and therefore subjected to severe functional requirements.

In the Cu-Al ball bond interface the growth of intermetallic compounds may deteriorate the electrical, thermal and mechanical properties.

Intermetallic compound, any of a class of substances composed of definite proportions of two or more elemental metals, rather than continuously variable proportions (as in solid solutions).The crystal structures and the properties of intermetallic compounds often differ markedly from those of their addition to the normal valences of their components, the relative.

The other titles in this four-volume set are: Crystal Structures of Intermetallic Compounds Basic Mechanical Properties and Lattice Defects of Intermetallic Compounds Magnetic, Electrical and Optical Properties and Applications of Intermetallic Compounds show. I.

Kornilov: The Mechanical Properties of Some Intermetallic Compounds of Iron and Nickel; Mechanical Properties of Intermetallic Compounds, John Wiley,p. Google Scholar Author: Philip Stark. Intermetallic Compounds, Magnetic, Electrical and Optical Properties and Applications of J.

Westbrook, R. Fleischer This volume is one of four, each of which consists of reprinted chapters from the highly acclaimed, comprehensive two-volume set Intermetallic Compounds: Principles and Practice. published in Intermetallic compounds (IMCs) that grow on the interface between the solder alloy and its bonding pads play a crucial role in the reliability of solder joints.

It has been identified that the cracking around the IMC layer is the primary failure mode in lead-free solder joints. Therefore the mechanical behavior of the IMC has attracted great attentions. Basic mechanical properties and lattice defects of intermetallic compounds.

Chichester, England ; New York: Wiley, (OCoLC) Material Type: Internet resource: Document Type: Book, Internet Resource: All Authors. Intermetallic Compounds: Basic Mechanical Properties and Lattice Defects of Intermetallic Compounds Westbrook, J. ISBN ISBN This third volume continues to set the standard in the field, as originally defined by the best-selling two-volume set Intermetallic Compounds: Principles and Practice.

With contributions from 72 authors from 14 different countries, this book introduces a broad range of new topics including: new intermetallic families, new means of assessment of bonding and stability, new properties. Mechanical properties of intermetallic compounds (IMCs) which were formed in electrodeposited Cu/Sn and Cu/Ni/Sn multilayered thin film have been investigated.

The layers of Cu, Sn and Ni were formed by electrodeposition technique using copper. Book Description. This book focuses on the role of modeling in the design of alloys and intermetallic compounds. It includes an introduction to the most important and most used modeling techniques, such as CALPHAD and ab-initio methods, as well as a section devoted to the latest developments in applications of alloys.

Stoichiometric intermetallic compounds have always been touted for their attractive chemical, physical, electrical, magnetic and mechanical properties, but few practical uses have materialized Cited by:   Mechanical and electrical properties of the Au-Al intermetallics layer were compared to the Cu-Al intermetallics layer.

A thermal aging test was used to expedite the formation and growth of the intermetallics layer. Dynamic hardness, surface hardness, and intermetallic thickness of both bonding systems was by: